JPH0510357Y2 - - Google Patents

Info

Publication number
JPH0510357Y2
JPH0510357Y2 JP1985125498U JP12549885U JPH0510357Y2 JP H0510357 Y2 JPH0510357 Y2 JP H0510357Y2 JP 1985125498 U JP1985125498 U JP 1985125498U JP 12549885 U JP12549885 U JP 12549885U JP H0510357 Y2 JPH0510357 Y2 JP H0510357Y2
Authority
JP
Japan
Prior art keywords
workpiece
bonding
temperature
heater block
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985125498U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234430U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985125498U priority Critical patent/JPH0510357Y2/ja
Publication of JPS6234430U publication Critical patent/JPS6234430U/ja
Application granted granted Critical
Publication of JPH0510357Y2 publication Critical patent/JPH0510357Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1985125498U 1985-08-17 1985-08-17 Expired - Lifetime JPH0510357Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985125498U JPH0510357Y2 (en]) 1985-08-17 1985-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985125498U JPH0510357Y2 (en]) 1985-08-17 1985-08-17

Publications (2)

Publication Number Publication Date
JPS6234430U JPS6234430U (en]) 1987-02-28
JPH0510357Y2 true JPH0510357Y2 (en]) 1993-03-15

Family

ID=31018447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985125498U Expired - Lifetime JPH0510357Y2 (en]) 1985-08-17 1985-08-17

Country Status (1)

Country Link
JP (1) JPH0510357Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115702489A (zh) * 2020-06-18 2023-02-14 库利克和索夫工业公司 用于如晶粒附接系统、覆晶接合系统、及片夹附接系统之设备的烤箱及相关方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605125U (ja) * 1983-05-31 1985-01-14 ロ−ム株式会社 半導体装置組み立て用ヒ−タブロツク
JPH0732168B2 (ja) * 1983-07-08 1995-04-10 株式会社東芝 半導体装置の製造方法
JPS60167336A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 加熱装置

Also Published As

Publication number Publication date
JPS6234430U (en]) 1987-02-28

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